GLOD product series is ultra micro powder dicyandiamide, a latent curing agent, which is used as the curing system of one component epoxy resin formulation system. Narrow and stable particle size distribution, mainly used in high temperature curing system, with standard bisphenol A epoxy (EEW ≈ 190), the recommended proportion of 6-10phr, conventional curing conditions for 180 ℃ / 30min. Different particle sizes can meet different processes and application fields. With our GLOC urea accelerator, the curing temperature can be further reduced and the curing speed can be accelerated.

Particle size : 98%≤10μm / 90%≤15μm

Application area: prepreg, adhesive, powder coating.